Role Overview
The Hybrid Bond Assembly Process Development Engineer will be responsible for the development, optimization, qualification, and technology transfer of advanced packaging assembly processes, specifically focusing on hybrid bonding and advanced die stacking technologies for HBM and next-generation products.
About Micron
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. With a focus on high-performance DRAM, NAND, and NOR memory, Micron fuels the data economy, enabling advances in artificial intelligence and 5G applications.