Intel

• Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs.

• Bachelor's degree with 4+ years of experience or Master's degree with 3+ years of experience or Ph.D in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.
• 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.

Required Skills & Tech