Role Overview
Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters. You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence, networking, high-performance computing, and 5G base stations.
About Broadcom
Broadcom is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.